What are the applications of foam materials in cell phones

Cushioning Protection
Between the screen and the frame: the cell phone screen is a more fragile components, between the screen and the cell phone frame will usually use foam material as a buffer. Such as when the phone is dropped or collided, foam can effectively absorb the impact, preventing the screen from being crushed or vibration and rupture, damage, and extend the service life of the screen.
Camera module peripheral: camera module lens, sensors and other components also need to be protected. Foam material is used in the periphery of the camera module, to play a buffer role, to avoid the daily use of the phone or the impact of external forces, the camera components collision between the damage caused by the camera, to ensure that the normal function of the photo and video.
Battery and cell phone interior: the battery in the cell phone also needs a stable installation environment, foam material used between the battery and the back of the phone or the battery and the motherboard, can cushion the battery from external forces, to prevent the battery from shifting and damage due to vibration or collision, but also to avoid the battery on the other parts of the extrusion.
Sealing and waterproofing
Cell phone bezel sealing: In the gaps of the cell phone bezel, the foam can play a sealing role to prevent dust, moisture, etc. from entering the interior of the phone. Some high-end cell phones with high waterproof and dustproof grade, foam material and sealant used in conjunction, can effectively enhance the sealing performance of the phone, so that the phone can be used normally in different environments.
Key sealing: cell phone buttons such as power button, volume keys, etc., between its and the phone shell will also use foam to seal. This not only prevents dust and moisture from entering the phone through the key gaps, but also makes the keys feel more comfortable and improves the user's operating experience.
Sound insulation and noise reduction
Between the earpiece and the motherboard: placing foam between the earpiece and the motherboard of the cell phone can effectively block the spread of sound inside the phone, reduce sound leakage and crosstalk, make the sound from the earpiece clearer, and improve the call quality.
Speaker periphery: the speaker will produce a certain amount of vibration and sound when working, foam material wrapped around the speaker, can absorb part of the energy generated by the speaker vibration, reduce the impact of vibration on other parts of the phone, but also can play a certain role in soundproofing, so that the sound emitted by the speaker is more pure, to avoid the emergence of murmur and resonance phenomenon.
Auxiliary Heat Dissipation
Between the heat dissipation module and the chip: some high-performance cell phones in order to ensure the stability of the chip and other components in the high-load operation, will be equipped with a heat dissipation module. Foam material has a certain degree of thermal insulation and thermal conductivity, can be used between the cooling module and the chip, to help better transfer the heat generated by the chip to the cooling module to improve the efficiency of heat dissipation, to ensure that the phone will not overheat in the course of a long period of time will not be overheated and performance degradation, crash and other problems.
Filling Fixing
Between the motherboard and the phone case: cell phone motherboard in the phone case needs to be kept stable, foam material can be used to fill the gap between the motherboard and the phone case, play a role in fixing the motherboard, to prevent the motherboard from shaking inside the phone, to ensure that the electronic components on the motherboard and the other parts of the connection is stable, to avoid failures due to poor contact.
Other parts filling: for some irregular space inside the phone or the gap between the components, foam material can be cut and filled as needed, so that the internal structure of the phone is more compact, the relative position of the components is more stable, conducive to the overall performance of the phone.